Capabilities

 

Hi-Tech offers an extensive broad arrange of electrical and electromechanical, and PCB manufacturing services. These services can include Engineering, PCB assembly, Design for Manufacturability (DFM), Design for Test (DFT), compliance testing, final packaging, and logistics. Innovation and investment in keeping Hi-Tech at the cutting edge helps maintain our position as an industry leader. Our state of the art 33,000 Sq. Ft. electronic assembly facility contains an impressive list of equipment including over 5000 Sq. Ft. medical clean room.

 

Our assembly capabilities include:

  • Surface Mount (SMT)

  • Through-Hole

  • Mixed Technologies

  • Single, Double, Multi Layer Rigid, Flex, Rigid-Flex

  • Solder & Washing PCB
  • AOI "Automated Optical Inspection"
  • Testing

  • Prototyping

  • Repair

  • Coating
  • Potting
  • Box Build
  • Parts & Logistics

SMT

Components Resistors, caps, diodes,Sips, Dips, IC, BGA, LED, Connectors, Headers, some through hole parts, ect.
Components Min x Max (W x L) (0.4 x 0.2mm ) 01005 - 100 x 45mm (3.94 x 1.77")
Components Min x Max Height .005 - 2.00"
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, ect.
Solder Paste Lead (62Sn/36Pb/2Ag) & Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), ect
Solder Paste Flux Lead-free, water soluble, rosin, No-clean, ect
PCB Min & Max (W x L) .100" x .100" min (Pallets) - 30" x 30" max
PCB Thickness Min - Max Thickness .010"(Fiber) (1mill Flex) min - .500" max
Paste Inspection 2D - Laser

 

 

Axial Insertion

Cycle Rate 14,000
Component Types Capacitors, resistors, diodes, jumpers, ect.
Hole Span 0.300"min - 0.950"max
Component Body Diameter 0.100" min - 0.460" width max
Lead Wire Diameter 0.015'min - 0.032"max
Pcb Min x Max (WxL) 2 x 2"" Min - 22' x 18.5" Max
Insertable Area (WxL) 20" x 18.5"
Board Error Correction BEC feature compensation for PCB pattern errors
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, ect.

 

 

Radial Insertion

Cycle Rate 11,000
Component Types Capacitors (electrolytic, ceramic, box, & film, hairpin resistors, diodes,SIPs, LEDs, tact switches, coils, pots, fuse clips, lamps, fuses, ect.
Compenent Max Size (LxDxH) 0.512" x 0.512" x 0.906"
Pcb Min x Max (WxL) 2 x 2"" Min - 22' x 18.5" Max
PCB Thickness Min x Max .010 Min - 0.250" Max
Insertable Area (WxL) 20" x 18.5"
Board Error Correction BEC feature compensation for PCB pattern errors
Verifier Expandable range verifier (ERV) ensures operato accuracy of component loading
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, ect.

 

 

DIP Insertion

Cycle Rate 4,500
Component Types

.300 Dip & Sockets

.600 Dip & Sockets
Compenent Max Size (LxDxH) 0.512" x 0.512" x 0.906"
Pcb Min x Max (WxL) 2 x 2" Min - 22' x 18.5" Max
PCB Thickness Min x Max .010 Min - 0.250" Max
Insertable Area (WxL) 20" x 18.5"
Board Error Correction BEC feature compensation for PCB pattern errors
Verifier Expandable range verifier (ERV) ensures operator accuracy of component loading
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, ect.

 

 

Solder Processing

Solder types Manual, Mass wave, Selective, hand, ect
Solder metals Lead (62Sn/36Pb/2Ag) & Lead-Free (96.5%Sn/3.0%Ag/0.5%Cu), ect
Flux materials VOC-free, Lead-free, water soluble, rosin, No-clean, ect
Fluxing Applicators Ultra sonic, spray, drop jet, foam, ect
PCB Min & Max (WxL) .100 x .100 min (Pallets) - 30" x 30" max
PCB Thickness Min - Max .010" min - 1" max
PCB materials Flex, rigid-flex, FR materials, cem materials, ect.

 

 

AOI "Automated Optical Inspection"

Inspection Types 3D-X-Ray, AOI Automatic Optical Inspection,
Magnification 255 time
Solder inspection Color & X-ray
PCB size Min - Max (WxL) .100" x.100 min - .30" x 30"max
PCB Materials Flex, rigid-flex, FR materials, cem materials, aluminum, single-double sided, multi-layered, ect.

 

Testing

Functional Burn-in, power up, cycle, ect
Flying Probe 24 probe, 35" x 25"max
RF Synthesized Signal Generator, Frequency Synthesizers,

 

 

Repair & Upgrade rework .

SMD Passives (01005on up), processors, BGA, ect.
Through Hole Axial, radial, dip, sip, transformers, connectors, headers, ect.
Cable Rigid wire, flex circuit, fiber optic, connectors, ect.
PCB Repair Trace, via, through hole, smt, ect.

 

 

Coating

Coating Materials Acrylic, silicon, UV, ect

 

 

Potting

Epoxy Materials 2 part epoxy, Urethane, Silicone, conductive, non-conductive, under fills, ect.

 

Box build

Box Build Wiring, assembly, testing, labeling, shipping, ect.

 

 

Parts Procurement

Purchasing World wide
Component Tacking 100% component & product tracking
Component Guarantee Hi-Tech sources only top quality components, including single, double and multi-layer boards, semiconductors, active and passive components, and electro-mechanical assemblies.

 

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Hi-Tech    25 Hi-Tech Drive    Oglesby, IL 61348    877.448.3245   sales@hitech5.com


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